First experimental observation of channel thickness scaling (down to 3 nm) induced mobility enhancement in UTB GeOI nMOSFETs

W. Chang, T. Irisawa, H. Ishii, H. Hattori, H. Ota, H. Takagi, Y. Kurashima, N. Uchida, T. Maeda
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引用次数: 8

Abstract

Electron mobility of ultra thin body (UTB) GeOI «MOSFETs with body thickness (Tbody) down to 3 nm has been systematically investigated and significant mobility enhancement with decreasing Tbody has been observed for the first time. This channel thickness scaling induced mobility enhancement can be attributed to the unique physical property of ultra thin Ge where the electron effective mass reduces with scaling Tbody through the band structure modification.
首次实验观察沟道厚度缩放(降至3nm)诱导UTB GeOI nmosfet迁移率增强
对体厚小于3nm的超薄体(UTB) GeOI«mosfet的电子迁移率进行了系统的研究,并首次观察到随着体厚的减小,电子迁移率显著增强。这种通道厚度缩放引起的迁移率增强可以归因于超薄锗独特的物理性质,通过能带结构修饰,电子有效质量随着缩放体的减小而减小。
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