Near-field injection at die level

Alexandre Boyer, B. Vrignon, M. Cavarroc, J. Shepherd
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引用次数: 3

Abstract

Near-field injection is a promising method in order to induce local faults in integrated circuits. This paper aims at proposing a model of the coupling between the injection probe and the circuit under test. This study relies on measurements performed on a test chip by on-chip voltage sensors.
在模具水平的近场注射
近场注入是解决集成电路局部故障的一种很有前途的方法。本文旨在建立一种注入探头与被测电路之间耦合的模型。这项研究依赖于通过片上电压传感器在测试芯片上进行的测量。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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