Design of CMOS Chip to Waveguide Transition in eWLB Package for Full W-band Applications

Abstract

This paper presents a low loss and wideband CMOS chip to waveguide transition in embedded wafer embedded wafer level ball grid array (eWLB) package for full W-band application. The layout of chip, package, board, and waveguide is necessary considered due to much electromagnetic coupling among them. The design of chip to waveguide transition is divided into multiple steps. The transition of chip to package is firstly investigated, and then the one of chip-package-board and chip-package-board-waveguide. Low loss and wideband impedance matching are realized by carefully designing the redistribution layer in eWLB package and transmission line (TL) on PCB. An inline board-to-waveguide transition is utilized due to an intermediate step of a dielectric filled rectangular waveguide, which can simply the fabrication and obtain high performance. The results show that the proposed approach is an attractive candidate for W-band application.