Dieneurethane adhesives in electronics

Abstract

Gluing of electronic components in addition to soldering increase the reliability of electronic appliances used under vibration, thermal shocks and high humidity. Adhesives for this purpose should bond a variety of substrates and provide compatibility with electronic components. In this case, compatibility is a complex characteristic which excludes: corrosive effects on metal surfaces, especially on electronic components; absorption of adhesive ingredients by electronic component active layers; negative adhesive effects on electric isolation disruption of electronic components. Polydiene urethane adhesives based on hydroxyl-containing oligodiene urethanes A, B, C, and D are compatible with electronic components and other electronic appliance substrates. In use, they are stable under thermal shock and thermo-wet conditions as well as under other loads. They can substitute for epoxy and polyesterurethane adhesives, and sometimes for the expensive room temperature setting polysiloxane adhesives. Polydiene urethane adhesive properties are being studied in other substrates, in the fixing of cables and cable bunches, and also in hermetic isolation of constructions for radio-electronic equipment.