Panel Discussion: Mask readiness for 3nm and beyond: a mask supplier’s perspective

Abstract

As EUV is adopted by more companies, the insertion strategy and timing begin to drive new mask requirements. Traditional lithography extensions employed for DUV may now appear with EUV, from ILT to PSM to aggressive use of pellicles. Looking beyond was has been successful with EUV HVM and towards what we anticipate the requirements will be for the future, this panel will provide a suppliers perspective on where they believe the mask infrastructure stands to support low-k1 imaging for 33NA today and the initial path to support 55NA tomorrow.