An Inductively Coupled Wireless Bus for Chiplet-Based Systems

Abstract

A wireless bus for inter-chiplet communication is presented. Utilizing horizontal inductive coupling of on-chip coils, wireless connection between chiplets are established. A test chip prototyped in 0.18 $\mu m$ CMOS confirms 2.0 Gb/s bus communication between horizontally arranged coils with BER of less than $10^{-12}$.