Bo Wang, Hong Wang, P. Cheng, Zhuo-qing Yang, G. Ding
{"title":"Optimizing the electroplating condition of an acid low cyanide silver bath and its application in micromachining","authors":"Bo Wang, Hong Wang, P. Cheng, Zhuo-qing Yang, G. Ding","doi":"10.1109/INEC.2016.7589458","DOIUrl":null,"url":null,"abstract":"In this paper, an acid low cyanide silver bath was introduced for producing silver film. The effect of current density and temperature of bath on the properties of silver film was studied. Through analyzing the crystalline grains and average roughness of silver film, the optimum current density and temperature were and 3mA/cm2 and 15°C. Then the patterning silver film was obtained by micromachining process under the optimum electroplating condition. The width of patterned photoresist was the same with the width of silver film which indicated it could be compatible with micromachining process.","PeriodicalId":416565,"journal":{"name":"2016 IEEE International Nanoelectronics Conference (INEC)","volume":"118 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2016-05-09","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2016 IEEE International Nanoelectronics Conference (INEC)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/INEC.2016.7589458","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 0
Abstract
In this paper, an acid low cyanide silver bath was introduced for producing silver film. The effect of current density and temperature of bath on the properties of silver film was studied. Through analyzing the crystalline grains and average roughness of silver film, the optimum current density and temperature were and 3mA/cm2 and 15°C. Then the patterning silver film was obtained by micromachining process under the optimum electroplating condition. The width of patterned photoresist was the same with the width of silver film which indicated it could be compatible with micromachining process.