CIM-SECDED: A 40nm 64Kb Compute In-Memory RRAM Macro with ECC Enabling Reliable Operation

Brian Crafton, S. Spetalnick, Jong-Hyeok Yoon, Wei Wu, Carlos Tokunaga, V. De, A. Raychowdhury
{"title":"CIM-SECDED: A 40nm 64Kb Compute In-Memory RRAM Macro with ECC Enabling Reliable Operation","authors":"Brian Crafton, S. Spetalnick, Jong-Hyeok Yoon, Wei Wu, Carlos Tokunaga, V. De, A. Raychowdhury","doi":"10.1109/A-SSCC53895.2021.9634742","DOIUrl":null,"url":null,"abstract":"Resistive RAM (RRAM) is a promising candidate for compute in-memory (CIM) applications owing to its natural multiply-and-accumulate structure in a 1T-1R bitcell, high-bit density, non-volatility, and voltage and process compatibility. These properties seek to advance applications such as AI with higher throughput and bit-density. However, due to process, temperature, and write-to-write variations the resistive state of each RRAM undergoes both spatial and temporal variations. Significant effort has been made to reduce the impact of device variation using iterative write verify (IWV) or training-aware approaches [1]. Unfortunately, traditional ECC is not compatible with CIM when multiple cells are read simultaneously on the same bitline. To address this issue at the circuit level, this paper presents a 64Kb RRAM macro in 40nm CMOS supporting SECDED (single error correction, double error detection) scheme compatible with CIM for any number of parallel row accesses. Compared to prior work, our results indicate that CIM-SECDED (1) improves bit error rate (BER) by up to $69.2 \\times $ for compute in-memory (2) relaxes the constraints on resistance variations and directly lowers IWV and write voltages. As a result, when applied to AI workloads we achieve (1) 24.4% (29.9%) accuracy improvement on the CIFAR10 (ImageNet) dataset (2) and consequently, improved endurance though lowering write voltage requirements [2].","PeriodicalId":286139,"journal":{"name":"2021 IEEE Asian Solid-State Circuits Conference (A-SSCC)","volume":"30 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2021-11-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"6","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2021 IEEE Asian Solid-State Circuits Conference (A-SSCC)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/A-SSCC53895.2021.9634742","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 6

Abstract

Resistive RAM (RRAM) is a promising candidate for compute in-memory (CIM) applications owing to its natural multiply-and-accumulate structure in a 1T-1R bitcell, high-bit density, non-volatility, and voltage and process compatibility. These properties seek to advance applications such as AI with higher throughput and bit-density. However, due to process, temperature, and write-to-write variations the resistive state of each RRAM undergoes both spatial and temporal variations. Significant effort has been made to reduce the impact of device variation using iterative write verify (IWV) or training-aware approaches [1]. Unfortunately, traditional ECC is not compatible with CIM when multiple cells are read simultaneously on the same bitline. To address this issue at the circuit level, this paper presents a 64Kb RRAM macro in 40nm CMOS supporting SECDED (single error correction, double error detection) scheme compatible with CIM for any number of parallel row accesses. Compared to prior work, our results indicate that CIM-SECDED (1) improves bit error rate (BER) by up to $69.2 \times $ for compute in-memory (2) relaxes the constraints on resistance variations and directly lowers IWV and write voltages. As a result, when applied to AI workloads we achieve (1) 24.4% (29.9%) accuracy improvement on the CIFAR10 (ImageNet) dataset (2) and consequently, improved endurance though lowering write voltage requirements [2].
CIM-SECDED:具有ECC的40nm 64Kb计算内存RRAM宏,可实现可靠操作
电阻性RAM (RRAM)由于其在1T-1R位单元中具有自然的乘法和累积结构、高比特密度、非易失性以及电压和工艺兼容性而成为内存中计算(CIM)应用的有希望的候选者。这些特性寻求以更高的吞吐量和比特密度推进人工智能等应用。然而,由于工艺、温度和写到写的变化,每个RRAM的电阻状态经历了空间和时间的变化。使用迭代写入验证(IWV)或训练感知方法来减少设备变化的影响已经做出了重大努力[1]。不幸的是,当在同一位线上同时读取多个单元时,传统的ECC与CIM不兼容。为了在电路层面解决这个问题,本文提出了一个40nm CMOS的64Kb RRAM宏,支持与CIM兼容的SECDED(单错误校正,双错误检测)方案,用于任何数量的并行行访问。与之前的工作相比,我们的研究结果表明,CIM-SECDED(1)将内存中计算的误码率(BER)提高了69.2倍(2)放宽了对电阻变化的限制,并直接降低了IWV和写入电压。因此,当应用于AI工作负载时,我们在CIFAR10 (ImageNet)数据集上实现了(1)24.4%(29.9%)的精度提高(2),从而通过降低写入电压要求提高了耐久性[2]。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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