{"title":"Cu/Photosensitive-BCB Thin-Film Multilayer Technology for High-Performance Multichip Module","authors":"T. Shimoto, K. Matsui, K. Utsumi","doi":"10.1109/ICMCM.1994.753538","DOIUrl":null,"url":null,"abstract":"A new MCM-D technology which enables reliable fabrication of high-performance and low cost MCMs has been developed. The technology is based on Cu/Photosensitive-BCB thin-film multilayer structure. The fabrication process is reduced by using the newly developed Photosensitive-BCB, with a conventional photolythography process. The flexibility on design rules is allowed, because the Cu/BCB structure has the advantages of excellent planarization, and low electrical resistance of signal line. Long-term reliability test was successfully done; thermal cycle(-45/spl deg/C/125/spl deg/), high-temperature aging at 125/spl deg/C, and high-temperature/humidity(85/spl deg/C/85%). A prototype of high-density RISC module fabricated with the developed technology passed all the long-term reliability tests. The excellent electrical performance was also proved through the signal transmission tests with the prototype module.","PeriodicalId":363745,"journal":{"name":"Proceedings of the International Conference on Multichip Modules","volume":"9 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1994-04-13","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"16","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Proceedings of the International Conference on Multichip Modules","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ICMCM.1994.753538","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 16
Abstract
A new MCM-D technology which enables reliable fabrication of high-performance and low cost MCMs has been developed. The technology is based on Cu/Photosensitive-BCB thin-film multilayer structure. The fabrication process is reduced by using the newly developed Photosensitive-BCB, with a conventional photolythography process. The flexibility on design rules is allowed, because the Cu/BCB structure has the advantages of excellent planarization, and low electrical resistance of signal line. Long-term reliability test was successfully done; thermal cycle(-45/spl deg/C/125/spl deg/), high-temperature aging at 125/spl deg/C, and high-temperature/humidity(85/spl deg/C/85%). A prototype of high-density RISC module fabricated with the developed technology passed all the long-term reliability tests. The excellent electrical performance was also proved through the signal transmission tests with the prototype module.