Cu/Photosensitive-BCB Thin-Film Multilayer Technology for High-Performance Multichip Module

T. Shimoto, K. Matsui, K. Utsumi
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引用次数: 16

Abstract

A new MCM-D technology which enables reliable fabrication of high-performance and low cost MCMs has been developed. The technology is based on Cu/Photosensitive-BCB thin-film multilayer structure. The fabrication process is reduced by using the newly developed Photosensitive-BCB, with a conventional photolythography process. The flexibility on design rules is allowed, because the Cu/BCB structure has the advantages of excellent planarization, and low electrical resistance of signal line. Long-term reliability test was successfully done; thermal cycle(-45/spl deg/C/125/spl deg/), high-temperature aging at 125/spl deg/C, and high-temperature/humidity(85/spl deg/C/85%). A prototype of high-density RISC module fabricated with the developed technology passed all the long-term reliability tests. The excellent electrical performance was also proved through the signal transmission tests with the prototype module.
用于高性能多芯片模块的Cu/光敏- bcb薄膜多层技术
一种新的MCM-D技术能够可靠地制造高性能和低成本的mcm。该技术基于Cu/光敏- bcb薄膜多层结构。采用新开发的光敏- bcb,减少了传统光刻工艺的制造过程。Cu/BCB结构具有平整度好、信号线电阻低的优点,允许设计规则的灵活性。长期可靠性试验成功;热循环(-45/spl°C/125/spl°C),高温老化(125/spl°C/高温),高温/湿度(85/spl°C/85%)。采用该技术制作的高密度RISC模块样机通过了所有长期可靠性测试。通过样机模块的信号传输测试,验证了其优良的电气性能。
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