Temperature-aware clock tree synthesis considering spatiotemporal hot spot correlations

Chunchen Liu, Junjie Su, Yiyu Shi
{"title":"Temperature-aware clock tree synthesis considering spatiotemporal hot spot correlations","authors":"Chunchen Liu, Junjie Su, Yiyu Shi","doi":"10.1109/ICCD.2008.4751848","DOIUrl":null,"url":null,"abstract":"Temperature variation in microprocessors is a workload dependent problem. In such a design, the clock skew should be minimized with respect to temperature variation. Existing work has studied clock tree embedding perturbation considering time variant temperature variation. There is no existing method that can reduce skew variation. This paper develops an efficient yet effective simultaneous hotspot avoid embedding and thermal aware routing (TMST) method, where hotspot embedding avoid tree topology located in area with high temperature possibility and thermal aware routing reduce skew in tree path with more smooth temperature area. With a thermally tolerable tree structure, our method can reduce not only delay skew but also skew variation (skew violation range). Compared with existing temperature-aware clock tree method, our TMST solution reduces skew variation by 2X compared with the greedy-DME (GDME) method of Edahiro and existing thermal aware clock synthesis TACO and PECO. With the scale from 100 down to 1 temperature maps, our TMST also guarantees the smallest wire length overflow. TMST reduces the worst case skew up to 4X than PECO and 5X than TACO.","PeriodicalId":345501,"journal":{"name":"2008 IEEE International Conference on Computer Design","volume":"35 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2008-10-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"14","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2008 IEEE International Conference on Computer Design","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ICCD.2008.4751848","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 14

Abstract

Temperature variation in microprocessors is a workload dependent problem. In such a design, the clock skew should be minimized with respect to temperature variation. Existing work has studied clock tree embedding perturbation considering time variant temperature variation. There is no existing method that can reduce skew variation. This paper develops an efficient yet effective simultaneous hotspot avoid embedding and thermal aware routing (TMST) method, where hotspot embedding avoid tree topology located in area with high temperature possibility and thermal aware routing reduce skew in tree path with more smooth temperature area. With a thermally tolerable tree structure, our method can reduce not only delay skew but also skew variation (skew violation range). Compared with existing temperature-aware clock tree method, our TMST solution reduces skew variation by 2X compared with the greedy-DME (GDME) method of Edahiro and existing thermal aware clock synthesis TACO and PECO. With the scale from 100 down to 1 temperature maps, our TMST also guarantees the smallest wire length overflow. TMST reduces the worst case skew up to 4X than PECO and 5X than TACO.
考虑时空热点相关性的温度感知时钟树合成
微处理器中的温度变化是一个与工作负载相关的问题。在这样的设计中,时钟的偏差应该与温度变化有关。已有的工作研究了考虑时变温度变化的时钟树嵌入微扰。目前还没有一种方法可以减少偏度变化。本文提出了一种高效且有效的同时嵌入热点和热感知路由(TMST)方法,其中热点嵌入避免了位于高温可能性区域的树状拓扑,热感知路由减少了温度区域更光滑的树状路径的偏移。该方法采用热容许树结构,不仅可以减少延迟偏斜,还可以减少偏斜变化(偏斜违反范围)。与现有的温度感知时钟树方法相比,我们的TMST解决方案比Edahiro的贪婪- dme (GDME)方法和现有的热感知时钟合成TACO和PECO减少了2X的偏度变化。从100到1温度图的比例,我们的TMST还保证最小的电线长度溢出。TMST减少了最坏情况下的倾斜,比PECO高4倍,比TACO高5倍。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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