Photonic wire bonding for single-mode chip-to-chip interconnects

N. Lindenmann, G. Balthasar, R. Palmer, Sven Schuele, J. Leuthold, W. Freude, C. Koos
{"title":"Photonic wire bonding for single-mode chip-to-chip interconnects","authors":"N. Lindenmann, G. Balthasar, R. Palmer, Sven Schuele, J. Leuthold, W. Freude, C. Koos","doi":"10.1109/GROUP4.2011.6053823","DOIUrl":null,"url":null,"abstract":"Photonic wire bonds (PWB) enable single-mode chip-to-chip interconnects that are suitable for mass production. We demonstrate for the first time a single-mode PWB link between two different nanophotonic silicon-on-insulator chips.","PeriodicalId":141233,"journal":{"name":"8th IEEE International Conference on Group IV Photonics","volume":"18 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2011-11-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"7","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"8th IEEE International Conference on Group IV Photonics","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/GROUP4.2011.6053823","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 7

Abstract

Photonic wire bonds (PWB) enable single-mode chip-to-chip interconnects that are suitable for mass production. We demonstrate for the first time a single-mode PWB link between two different nanophotonic silicon-on-insulator chips.
单模芯片对芯片互连的光子线键合
光子线键(PWB)实现单模芯片到芯片的互连,适合大规模生产。我们首次展示了两个不同的纳米光子绝缘体上硅芯片之间的单模PWB链路。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
求助全文
约1分钟内获得全文 求助全文
来源期刊
自引率
0.00%
发文量
0
×
引用
GB/T 7714-2015
复制
MLA
复制
APA
复制
导出至
BibTeX EndNote RefMan NoteFirst NoteExpress
×
提示
您的信息不完整,为了账户安全,请先补充。
现在去补充
×
提示
您因"违规操作"
具体请查看互助需知
我知道了
×
提示
确定
请完成安全验证×
copy
已复制链接
快去分享给好友吧!
我知道了
右上角分享
点击右上角分享
0
联系我们:info@booksci.cn Book学术提供免费学术资源搜索服务,方便国内外学者检索中英文文献。致力于提供最便捷和优质的服务体验。 Copyright © 2023 布克学术 All rights reserved.
京ICP备2023020795号-1
ghs 京公网安备 11010802042870号
Book学术文献互助
Book学术文献互助群
群 号:481959085
Book学术官方微信