Towards the limits of thick-film resistors' miniaturization

T. Józenków, D. Nowak
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Abstract

This paper presents results of investigations devoted to miniaturization of thick-film resistors with the aid of laser cutting. The investigations were aimed at miniaturization of two resistor dimensions, namely length and width. Test structures were based on various combination of conductive and resistive inks deposited on Al2O3, or LTCC substrates. Resistors made in standard screen printing process after being fired were patterned using laser beam in order to minimize their planar dimensions to tenths of millimeter and below. Prepared samples were subjected to number of electrical tests and some characteristic parameters, like temperature coefficient of resistance (TCR) or pulse durability were calculated based on these measurements. Test samples were also exposed to long-term thermal ageing. The received parameters were compared to those exhibited by resistors with standard dimensions in order to evaluate differences in characteristics and to determine the current miniaturization limits of such components.
走向厚膜电阻器小型化的极限
本文介绍了利用激光切割技术实现厚膜电阻器微型化的研究结果。研究的目标是两个电阻尺寸的小型化,即长度和宽度。测试结构基于沉积在Al2O3或LTCC衬底上的导电和电阻油墨的各种组合。在标准丝网印刷工艺中,电阻器在烧制后使用激光束进行图像化,以便将其平面尺寸减小到十分之一毫米及以下。制备的样品进行了多次电学测试,并在此基础上计算了一些特征参数,如温度电阻系数(TCR)或脉冲耐久性。测试样品也暴露在长期热老化中。将接收到的参数与具有标准尺寸的电阻器所显示的参数进行比较,以评估特性的差异并确定此类组件的当前小型化极限。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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