Introducing novel “Rigid Carrier with Composite Release Layer” to assemble ultra-high density Advanced Packages & Substrates in wafer and panel format

Abstract

Rigid carrier substrates are essential to support assembly of advanced ultra-thin high-density packages and modules on wafer and panel format. An organic bonding-debonding layer is applied on the carrier which remains all through assembly and detached/released once package assembly is completed. Today borosilicate glass is used as carrier material. With the need for advanced package architecture, the organic bonding/debonding materials have reached their limits, with process and yield related issues. Further, besides the restriction to use high-cost borosilicate glass as carrier material, there are several other technical issues associated with organic bonding-debonding release material. In this paper these details have been discussed and an alternate material set is described. A new “Rigid carrier with composite inorganic release layer” is introduced. It overcomes the current assembly issues along with the opportunity to reduce total manufacturing cost, with availability of several low-cost rigid substrate carrier materials. This novel material set is referred as HRDP® (High Resolution Debondable Panel) and is available in large size wafer and panel formats. The HRDP serves as a drop-in solution to existing assembly flow. This paper describes the new material set, process details to achieve ultra-fine line/space (<1um), impact on warpage and debonding release force, chemical and thermal resistance results as well as cost comparison data.