CAD infrastructure for high performance design

W. Vercruysse
{"title":"CAD infrastructure for high performance design","authors":"W. Vercruysse","doi":"10.1109/VTSA.2001.934543","DOIUrl":null,"url":null,"abstract":"Larger designs and deep submicron effects have fueled an increase in design complexity. First the author describes how these design trends impact his methodology and reports on the growth he experienced as a result. The author then discusses how the CAD environment was setup for the design of the UltraSPARC-III.","PeriodicalId":388391,"journal":{"name":"2001 International Symposium on VLSI Technology, Systems, and Applications. Proceedings of Technical Papers (Cat. No.01TH8517)","volume":"4 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2001-04-18","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2001 International Symposium on VLSI Technology, Systems, and Applications. Proceedings of Technical Papers (Cat. No.01TH8517)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/VTSA.2001.934543","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
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Abstract

Larger designs and deep submicron effects have fueled an increase in design complexity. First the author describes how these design trends impact his methodology and reports on the growth he experienced as a result. The author then discusses how the CAD environment was setup for the design of the UltraSPARC-III.
用于高性能设计的CAD基础设施
更大的设计和深度亚微米效应推动了设计复杂性的增加。首先,作者描述了这些设计趋势如何影响他的方法论,并报告了他所经历的增长。然后讨论了如何为UltraSPARC-III的设计建立CAD环境。
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