Miniature Thermoelectric Modules with Increased Cooling Power

Abstract

Progress in developing high cooling power, short-legged thermoelectric coolers (TECs) for local cooling of high power density electro-optic components is represented. Different competitive methods aimed toward TEC miniaturization, such as processing of bulk materials as well as thin-film and thick-film technique, are analyzed and their advantages and disadvantages are discussed. Bulk material based technology is developed which allow production of TECs with TE leg height below 0.2 mm. The TECs show temperature differences comparable to those for standard bulk coolers