Standard Cell Placement Using Simulated Sintering

Lov K. Grover
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引用次数: 41

Abstract

Simulated annealing is a powerful optimization technique based on the annealing phenomenon in crystallization. In this paper we propose a simulated sintering technique which is analogous to the sintering process in material processing. In sintering one improves the quality of a processed material by heating it to a temperature close to the melting point. Analogously, we show that by starting out with a good initial configuration instead of a random configuration, and restricting uphill moves, we can considerably speed up simulated annealing. We use this idea for a standard cell placement program - GRIM in LTX2, an AT&T Bell Labs VLSI layout system. The initial configuration is produced either by changes to a layout the designer had done previously, or else by a fast program like min-cut. We obtain improvements of about 10% in chip area starting from a min-cut placement, in times about 3 times faster than our simulated annealing program (which itself is several times faster than other well known simulated annealing programs).
使用模拟烧结的标准电池放置
模拟退火是一种基于结晶过程中退火现象的有效优化技术。本文提出了一种模拟烧结技术,它类似于材料加工中的烧结过程。在烧结中,人们通过将加工材料加热到接近熔点的温度来提高其质量。类似地,我们表明,通过从一个良好的初始配置开始,而不是随机配置,并限制上坡移动,我们可以大大加快模拟退火。我们将这个想法用于LTX2中的标准单元放置程序- GRIM,这是AT&T贝尔实验室的VLSI布局系统。初始配置要么是通过改变设计师之前所做的布局,要么是通过像min-cut这样的快速程序产生的。从最小切割位置开始,我们获得了约10%的芯片面积改进,比我们的模拟退火程序快约3倍(其本身比其他已知的模拟退火程序快几倍)。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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