Dsm Interconnect Modeling And Analysis For Performance And Reliability

A. Kahng, S. Muddut
{"title":"Dsm Interconnect Modeling And Analysis For Performance And Reliability","authors":"A. Kahng, S. Muddut","doi":"10.1109/ASIC.1998.723091","DOIUrl":null,"url":null,"abstract":"DSM interconnects have a dominant impact on the achievable performance of integrated circuits. A broad spectrum of issues must be dealt with by design tools and methodologies to achieve successful outcomes. This tutorial develops the fundamentals of DSM interconnect modeling and analysis, starting with the underlying process technology and design methodology contexts, and continuing with interconnect performance and reliability analyses, frontend interconnect metrics and models, and modeling for interconnect synthesis and optimization. The tutorial’s intended audience consists of ASIC designers, design tool users, and CAD developers. The material will be presented in a form (slides, pseudocode fragments, reference lists) that attendees can take away and immediately use.","PeriodicalId":104431,"journal":{"name":"Proceedings Eleventh Annual IEEE International ASIC Conference (Cat. No.98TH8372)","volume":"35 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1998-09-13","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Proceedings Eleventh Annual IEEE International ASIC Conference (Cat. No.98TH8372)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ASIC.1998.723091","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 0

Abstract

DSM interconnects have a dominant impact on the achievable performance of integrated circuits. A broad spectrum of issues must be dealt with by design tools and methodologies to achieve successful outcomes. This tutorial develops the fundamentals of DSM interconnect modeling and analysis, starting with the underlying process technology and design methodology contexts, and continuing with interconnect performance and reliability analyses, frontend interconnect metrics and models, and modeling for interconnect synthesis and optimization. The tutorial’s intended audience consists of ASIC designers, design tool users, and CAD developers. The material will be presented in a form (slides, pseudocode fragments, reference lists) that attendees can take away and immediately use.
基于性能和可靠性的Dsm互连建模与分析
DSM互连对集成电路的可实现性能具有主要影响。为了获得成功的结果,必须通过设计工具和方法处理广泛的问题。本教程开发了DSM互连建模和分析的基础知识,从底层流程技术和设计方法上下文开始,继续介绍互连性能和可靠性分析、前端互连度量和模型,以及互连综合和优化的建模。本教程的目标读者包括ASIC设计人员、设计工具用户和CAD开发人员。材料将以一种形式呈现(幻灯片、伪代码片段、参考列表),与会者可以带走并立即使用。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
求助全文
约1分钟内获得全文 求助全文
来源期刊
自引率
0.00%
发文量
0
×
引用
GB/T 7714-2015
复制
MLA
复制
APA
复制
导出至
BibTeX EndNote RefMan NoteFirst NoteExpress
×
提示
您的信息不完整,为了账户安全,请先补充。
现在去补充
×
提示
您因"违规操作"
具体请查看互助需知
我知道了
×
提示
确定
请完成安全验证×
copy
已复制链接
快去分享给好友吧!
我知道了
右上角分享
点击右上角分享
0
联系我们:info@booksci.cn Book学术提供免费学术资源搜索服务,方便国内外学者检索中英文文献。致力于提供最便捷和优质的服务体验。 Copyright © 2023 布克学术 All rights reserved.
京ICP备2023020795号-1
ghs 京公网安备 11010802042870号
Book学术文献互助
Book学术文献互助群
群 号:481959085
Book学术官方微信