You-Seok Suh, G. Heuss, H. Zhong, Shin-Nam Hong, V. Misra
{"title":"Electrical characteristics of TaSi/sub x/N/sub y/ gate electrodes for dual gate Si-CMOS devices","authors":"You-Seok Suh, G. Heuss, H. Zhong, Shin-Nam Hong, V. Misra","doi":"10.1109/VLSIT.2001.934940","DOIUrl":null,"url":null,"abstract":"In this work, the physical and electrical properties of TaSi/sub x/N/sub y/ films are evaluated for gate electrode applications. MOS capacitors with TaSi/sub x/N/sub y/ gates of varying N concentrations were fabricated. The stability of TaSi/sub x/N/sub y//SiO/sub 2//p-type Si stacks was studied at annealing temperatures of 700/spl deg/C, 900/spl deg/C, and 1000/spl deg/C in Ar. When the nitrogen content exceeds 35 at%, excellent stability of oxide thickness and gate current is observed for anneals up to 1000/spl deg/C. The results also indicate that the work function of TaSi/sub x/N/sub y/ is compatible with NMOS devices.","PeriodicalId":232773,"journal":{"name":"2001 Symposium on VLSI Technology. Digest of Technical Papers (IEEE Cat. No.01 CH37184)","volume":"62 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2001-06-12","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"15","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2001 Symposium on VLSI Technology. Digest of Technical Papers (IEEE Cat. No.01 CH37184)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/VLSIT.2001.934940","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 15
Abstract
In this work, the physical and electrical properties of TaSi/sub x/N/sub y/ films are evaluated for gate electrode applications. MOS capacitors with TaSi/sub x/N/sub y/ gates of varying N concentrations were fabricated. The stability of TaSi/sub x/N/sub y//SiO/sub 2//p-type Si stacks was studied at annealing temperatures of 700/spl deg/C, 900/spl deg/C, and 1000/spl deg/C in Ar. When the nitrogen content exceeds 35 at%, excellent stability of oxide thickness and gate current is observed for anneals up to 1000/spl deg/C. The results also indicate that the work function of TaSi/sub x/N/sub y/ is compatible with NMOS devices.