Performance limitations and reliability of power devices: A thermal insight

A. Silard, M. Bodea
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引用次数: 1

Abstract

An investigation of the power performance limitations or power devices due to thermal failure has been performed under steady-state and transient conditions. The maximum thermal resistance Rθthat prevents thermal runaway under various blocking conditions was computed as a function of applied voltage VAand of leakage current Io. The dependences Rθ=f (VA,Io) were computed for the worst cases and their validity had been proved by experimental data on diodes, transistors and thyristors. The reliability and performance limitations of devices under transient conditions had been investigated for the most complex case, i.e. the transient thermal response of an amplifying gate thyristor (a.g.t.) during its firing. The analytical model and basic computer procedure are described in detail. A good agreement was found between computed values and experimental data for maximum temperature Tm.
功率器件的性能限制和可靠性:热洞察
在稳态和瞬态条件下,研究了由于热失效引起的功率性能限制或功率器件。计算了各种阻塞条件下防止热失控的最大热阻r θ与外加电压v和漏电流o的函数关系。计算了最坏情况下的依赖关系Rθ=f (VA,Io),并用二极管、晶体管和晶闸管的实验数据证明了其有效性。对于最复杂的情况,即放大栅晶闸管(a.g.t.)在其点火过程中的瞬态热响应,研究了器件在瞬态条件下的可靠性和性能限制。详细介绍了分析模型和计算机基本程序。最高温度Tm的计算值与实验值吻合较好。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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