Highly Integrated SIP for Mobile Device

Abstract

In mobile application, to integrate the required functions in the limited area is one of the key points of the success of the products. The industries have studied the way of integration method by adopting system on chip or system in package approach. With the conventional approach using laminate substrate, there had been the limit of integration due to its limited pattern capability and larger keep out zone for underfill. It's known that fan-out package is one of the effective solutions to make the compact system. One of the most important factors is to achieve fine joint pitch to make the system within Package on Package format. In this study, the system integration by using advanced packaging technology like fan-out PLP will be provided. One of wearable devices had been selected to see the effect of integration. In conventional approach, the devices had been placed on main PCB, respectively. To make the area compact, some of PKG types were selected and compared. Finally, we had found the most effective package format for fine form factor.