{"title":"Research and analysis of heat exchange processes of a micromechanical mirror based on a thermal microactuator","authors":"S. Evstafyev, V. Samoylikov","doi":"10.1117/12.2520519","DOIUrl":null,"url":null,"abstract":"This paper considers the multi-sectional structure of the thermal micromechanical mirror element, developed and manufactured by the National Research University \"MIET\". The structure consists of a movable part and a fixed part. The movable part includes a pair of thermal microactuators based on a multilayer structure of silicon oxide and aluminum, and a mirror reflecting element coated with aluminum. The fixed part is the area of attachment of the element to the silicon wafer. The temperature distribution along the length of the multi-sectional structure of the thermal microactuator is calculated taking into account the effect of the system of transverse heat-conducting structures under various heating conditions. An essential difference between the calculations, reaching two times, was established. The experimental studies showed the adequacy of the calculation results and proved that the calculation of the temperature distribution should take into account the cooling effect of transverse heat-conducting structures. Based on the calculations and experimental studies, a technique is proposed for analyzing the thermal state of the microactuator that takes into account the cooling effect of the transverse heat-conducting structures.","PeriodicalId":388511,"journal":{"name":"International Conference on Micro- and Nano-Electronics","volume":"72 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2019-03-15","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"1","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"International Conference on Micro- and Nano-Electronics","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1117/12.2520519","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 1
Abstract
This paper considers the multi-sectional structure of the thermal micromechanical mirror element, developed and manufactured by the National Research University "MIET". The structure consists of a movable part and a fixed part. The movable part includes a pair of thermal microactuators based on a multilayer structure of silicon oxide and aluminum, and a mirror reflecting element coated with aluminum. The fixed part is the area of attachment of the element to the silicon wafer. The temperature distribution along the length of the multi-sectional structure of the thermal microactuator is calculated taking into account the effect of the system of transverse heat-conducting structures under various heating conditions. An essential difference between the calculations, reaching two times, was established. The experimental studies showed the adequacy of the calculation results and proved that the calculation of the temperature distribution should take into account the cooling effect of transverse heat-conducting structures. Based on the calculations and experimental studies, a technique is proposed for analyzing the thermal state of the microactuator that takes into account the cooling effect of the transverse heat-conducting structures.