Influence of strain field on nanoscale electronic processes in silicon-based semiconductors

A. Lepadatu, C. Palade, A. Slav, S. Lazanu
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Abstract

The effects of strain field are studied in Si wafers implanted with heavy iodine and bismuth ions and in multi-quantum well structures. The experimental method of thermally stimulated currents without applied bias is used, and the trapping centres parameters are determined by modelling the discharge curves. In both cases, the strain field produces temperature-dependent parameters of trapping levels. So, due to the high strain field in the neighbourhood of implanted ions, energy levels broaden and cross sections become temperature dependent. In multilayer structures, for the trapping centres corresponding to strain-induced defects both concentrations and capture cross sections are temperature dependent.
应变场对硅基半导体纳米级电子工艺的影响
研究了重碘、重铋离子注入硅片和多量子阱结构中应变场的影响。采用无外加偏置的热激电流实验方法,通过模拟放电曲线确定捕获中心参数。在这两种情况下,应变场产生与温度有关的俘获水平参数。因此,由于注入离子附近的高应变场,能级变宽,截面变得依赖于温度。在多层结构中,对于与应变诱导缺陷相对应的俘获中心,浓度和俘获截面都与温度有关。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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