{"title":"Flexible electronics - opportunities and challenges","authors":"M. Deen","doi":"10.1109/EDSSC.2013.6628198","DOIUrl":null,"url":null,"abstract":"The use of organic/polymeric materials to create thin film transistors on flexible substrates has advanced significantly in the past few decades. These advances are stimulated by the promise of low-cost, lighter and more robust devices and systems for applications that include large area electronics and displays, sensors and wearable systems. However, there are still many challenges to be solved before flexible electronics can realize its potential. These challenges include hysteresis and contacts effects, accurate static/dynamic compact models, and improved stability, reliability, and lifetime.","PeriodicalId":333267,"journal":{"name":"2013 IEEE International Conference of Electron Devices and Solid-state Circuits","volume":"522 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2013-06-03","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"6","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2013 IEEE International Conference of Electron Devices and Solid-state Circuits","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/EDSSC.2013.6628198","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 6
Abstract
The use of organic/polymeric materials to create thin film transistors on flexible substrates has advanced significantly in the past few decades. These advances are stimulated by the promise of low-cost, lighter and more robust devices and systems for applications that include large area electronics and displays, sensors and wearable systems. However, there are still many challenges to be solved before flexible electronics can realize its potential. These challenges include hysteresis and contacts effects, accurate static/dynamic compact models, and improved stability, reliability, and lifetime.