Modeling the impact of back-end process variation on circuit performance

D. Sylvester, O. S. Nakagawa, C. Hu
{"title":"Modeling the impact of back-end process variation on circuit performance","authors":"D. Sylvester, O. S. Nakagawa, C. Hu","doi":"10.1109/VTSA.1999.785999","DOIUrl":null,"url":null,"abstract":"We present a stochastic approach to account for on-chip interconnect process variation. A Monte Carlo approach is taken using actual process distributions to generate realistic 3-D performance corners. Accurate analytical models are used to provide a >3 order of magnitude speedup over simulation techniques. Resulting delay and noise performance spreads are 33 to 63% tighter than those found using a conventional technique. We apply this method to a clock distribution network to more precisely determine clock skew.","PeriodicalId":237214,"journal":{"name":"1999 International Symposium on VLSI Technology, Systems, and Applications. Proceedings of Technical Papers. (Cat. No.99TH8453)","volume":"45 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1999-06-08","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"18","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"1999 International Symposium on VLSI Technology, Systems, and Applications. Proceedings of Technical Papers. (Cat. No.99TH8453)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/VTSA.1999.785999","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 18

Abstract

We present a stochastic approach to account for on-chip interconnect process variation. A Monte Carlo approach is taken using actual process distributions to generate realistic 3-D performance corners. Accurate analytical models are used to provide a >3 order of magnitude speedup over simulation techniques. Resulting delay and noise performance spreads are 33 to 63% tighter than those found using a conventional technique. We apply this method to a clock distribution network to more precisely determine clock skew.
模拟后端工艺变化对电路性能的影响
我们提出了一种随机方法来解释片上互连过程的变化。采用蒙特卡罗方法,利用实际过程分布来生成逼真的三维性能角。使用精确的分析模型提供了一个>3个数量级的速度比模拟技术。由此产生的延迟和噪声性能比使用传统技术的延迟和噪声性能差缩小了33%到63%。我们将此方法应用于时钟分布网络,以更精确地确定时钟偏差。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
求助全文
约1分钟内获得全文 求助全文
来源期刊
自引率
0.00%
发文量
0
×
引用
GB/T 7714-2015
复制
MLA
复制
APA
复制
导出至
BibTeX EndNote RefMan NoteFirst NoteExpress
×
提示
您的信息不完整,为了账户安全,请先补充。
现在去补充
×
提示
您因"违规操作"
具体请查看互助需知
我知道了
×
提示
确定
请完成安全验证×
copy
已复制链接
快去分享给好友吧!
我知道了
右上角分享
点击右上角分享
0
联系我们:info@booksci.cn Book学术提供免费学术资源搜索服务,方便国内外学者检索中英文文献。致力于提供最便捷和优质的服务体验。 Copyright © 2023 布克学术 All rights reserved.
京ICP备2023020795号-1
ghs 京公网安备 11010802042870号
Book学术文献互助
Book学术文献互助群
群 号:604180095
Book学术官方微信