Kei Fukunaga, Takumi Sugitani, Y. Yamaguchi, Daisuke Tsunami, M. Hangai, S. Shinjo
{"title":"X-band 100 W-class Broadband High Power Amplifier Using High Power Density GaN-HEMTs","authors":"Kei Fukunaga, Takumi Sugitani, Y. Yamaguchi, Daisuke Tsunami, M. Hangai, S. Shinjo","doi":"10.1109/RFIT49453.2020.9226232","DOIUrl":null,"url":null,"abstract":"In this paper, an X-band 100 W class high power amplifier GaN monolithic microwave integrated circuit (MMIC) is presented. A GaN high electron mobility transistor (HEMT) with a power density exceeding 10 W/mm has been developed by achieving both electric field relief and high power density to increase the amplifier output. This high power amplifier GaN MMIC is manufactured using a GaN HEMT, which has high power density. Measurement results of the two-stage amplifier MMIC show output power of 80–100 W, a power added efficiency (PAE) of 42%, and a gain of 18 dB. This result is comparable with the best state-of-the-art X-band MMIC power amplifiers ever reported. This indicates that the developed amplifier has an advantage when it is utilized in a transmit module.","PeriodicalId":283714,"journal":{"name":"2020 IEEE International Symposium on Radio-Frequency Integration Technology (RFIT)","volume":"19 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2020-09-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"1","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2020 IEEE International Symposium on Radio-Frequency Integration Technology (RFIT)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/RFIT49453.2020.9226232","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 1
Abstract
In this paper, an X-band 100 W class high power amplifier GaN monolithic microwave integrated circuit (MMIC) is presented. A GaN high electron mobility transistor (HEMT) with a power density exceeding 10 W/mm has been developed by achieving both electric field relief and high power density to increase the amplifier output. This high power amplifier GaN MMIC is manufactured using a GaN HEMT, which has high power density. Measurement results of the two-stage amplifier MMIC show output power of 80–100 W, a power added efficiency (PAE) of 42%, and a gain of 18 dB. This result is comparable with the best state-of-the-art X-band MMIC power amplifiers ever reported. This indicates that the developed amplifier has an advantage when it is utilized in a transmit module.