An EMI estimation for shielding edge treaments on a printed circuit board

Abstract

Various PCB edge treatments including via stitching and edge plating connecting ground planes can be employed to suppress the EMI from multilayer printed circuit boards. The shielding performance of these edge treatments is studied in this work. Design curves and an empirical equation are given based on parametric study to summarize the variation of the total radiated power (TRP) as a function of slot length (spacing between vias) and number of openings. Comparisons between measurements and simulation suitably agree within engineering accuracy.