{"title":"Yield Ramp up by Scan Chain Diagnosis","authors":"F. Kuo, Yuan-Shih Chen","doi":"10.1109/ATS.2009.70","DOIUrl":null,"url":null,"abstract":"Advances in the semiconductor manufacturing technologies have resulted in the defect distribution to both random defects and process weakness due to smaller geometry. The keep-increasing complexity of the designs makes the traditional failure analysis and yield learning techniques inadequate for finding the root cause.","PeriodicalId":106283,"journal":{"name":"2009 Asian Test Symposium","volume":"48 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2009-11-23","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"7","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2009 Asian Test Symposium","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ATS.2009.70","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 7
Abstract
Advances in the semiconductor manufacturing technologies have resulted in the defect distribution to both random defects and process weakness due to smaller geometry. The keep-increasing complexity of the designs makes the traditional failure analysis and yield learning techniques inadequate for finding the root cause.