Analysis of mixed CNT bundle interconnects: Impact on delay and power dissipation

Abstract

This research paper proposes a hierarchical modelling approach for mixed carbon nanotube (CNT) bundle (MCB) interconnects. Based on the arrangements of single-walled CNTs (SWCNT) and multi-walled CNTs (MWCNTs), three different MCB structures are proposed. Transient analysis is performed for bundled CNT structures to address the effect of propagation delay and power dissipation. It has been observed that the delay and power dissipation are significantly improved for the proposed MCB structures as compared to bundled SWCNT and bundled MWCNT at different global interconnect lengths.