The Void-free Reflow Soldering of BGA with Vacuum

Abstract

During reflow soldering of BGA. voids are very easily produced in the solder joints. Void formation in solder joints is one of the many critical factors governing the solder joint reliability. Voids may degrade the mechanical robustness of the board level interconnection and consequently affect the reliability, the electrical and thermal conducting performance of the solder joint. In order to avoid void formation in the solder joints during the reflow soldering of BGA. we must reduce oxidation of solder, the metallization of the substrate, component or the solder powder surface, decrease gas production during soldering, make gas degassing from molten solder easily. Vacuum reflow soldering technology can greatly satisfy the three requests. It has been proved that vacuum reflow solder technology is a valid technology for the void-free and lead-free soldering of BGA. not only can we use it to reflow solder BGA. But also to rework BGA with voids in solder joints.