Implementation of low jitter clock distribution using chip-package hybrid interconnection

Chunghyun Ryu, Daehyun Chung, Kicheol Bae, Jiheon Yu, Joungho Kim
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Abstract

As the clock frequency of digital systems goes higher up to multi-GHz, it is getting more important to distribute the clock signal to each destination with minimum timing jitter as not to exceed the timing margin of the system. For the lossy characteristic of on-chip interconnection lines, repeaters are indispensable to distribute the clock signal on a chip and the number of repeaters is increasing as clock frequency goes up for reliable signal quality. However, these kinds of repeaters can cause timing jitter on the clock signal when they are affected by power supply noise which is usually generated by logic core operation. This work shows a possible solution for the problem, that is, chip-package hybrid interconnection by which some repeaters are no longer necessary and verifies that the hybrid interconnection reduces clock jitter dramatically through implementation and measurement.
采用芯片-封装混合互连实现低抖动时钟分配
随着数字系统时钟频率越来越高,甚至达到多ghz,如何以最小的时间抖动将时钟信号分配到各个目的地,使其不超过系统的时间裕度变得越来越重要。由于片上互连线路的有损特性,时钟信号在芯片上的分布需要中继器,为了保证可靠的信号质量,随着时钟频率的提高,中继器的数量也在不断增加。然而,当这些中继器受到电源噪声的影响时,时钟信号会产生时序抖动,而电源噪声通常是由逻辑核心操作产生的。本研究提出了一种可能的解决方案,即不再需要某些中继器的芯片封装混合互连,并通过实现和测量验证了混合互连显著降低了时钟抖动。
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