Temperature-Aware Evaluation and Mitigation of Logic Soft Errors Under Circuit Variations

Warin Sootkaneung, S. Chookaew, S. Howimanporn
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Abstract

While supply voltage and frequency directly affect circuit soft errors, thermal response from tuning these two parameters also provides a moderate side effect. This study firstly improves the accuracy of logic soft error estimation by taking into consideration the thermal impact from supply voltage and frequency variations. In the presence of the inversion of the temperature effect where the drive current of some modern designs increases at high temperature, we also take a benefit of this effect to develop a novel soft error mitigation technique by adaptively regulating the chip temperature. This technique can moderately reduce high soft error rate of combinational blocks during low voltage operation with neglectable power overhead.
电路变化下的温度感知逻辑软误差评估与缓解
虽然电源电压和频率直接影响电路软误差,但调整这两个参数的热响应也提供了适度的副作用。该研究首先考虑了电源电压和频率变化的热影响,提高了逻辑软误差估计的精度。在一些现代设计的驱动电流在高温下增加的温度效应的反转存在的情况下,我们也利用这一效应,开发了一种新的软误差缓解技术,通过自适应调节芯片温度。该技术可以在可忽略的功率开销下适度降低组合块在低压运行时的高软错误率。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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