Electron beam doping (superdiffusion) in damage-free regions of semiconductors by the kick-out mechanism (SIMS and PL measurements)

T. Wada, T. Kato, H. Fujomoto, F. Yasui, K. Ohtsu, T. Saka
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Abstract

It is shown that electron-beam doping processes (superdiffusion) in semiconductors are useful for microprocesses, even in the damage-free region and at room temperature, and these experimental results are in good agreement with the exact solutions of the so-called kick-out mechanism. Silicon and zinc atoms diffuse into GaAs wafers, respectively due to the kick-out mechanism by electron beam doping.
电子束在半导体无损伤区通过踢出机制掺杂(超扩散)(SIMS和PL测量)
结果表明,即使在无损伤区和室温下,半导体中的电子束掺杂过程(超扩散)对微过程也是有用的,并且这些实验结果与所谓的踢出机制的精确解是一致的。由于电子束掺杂的踢出机制,硅原子和锌原子分别扩散到砷化镓晶圆中。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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