MCM-L Compatible Integrated Resistors And Capacitors

Proceedings. 4th International Symposium on Advanced Packaging Materials Processes, Properties and Interfaces (Cat. No.98EX153) Pub Date : 1998-03-18 DOI:10.1109/ISAPM.1998.664473

S. Bhattacharya, Y. W. Kim, P. Chahal, M. Allen, R. Tummala, R. Hubbard

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引用次数: 3

Abstract

Integration of passive components offers inherent benefits such as reduced size, density, cost, and improved packaging efficiency and reliability. An integrated RC network requiring relatively large capacitance and resistance was selected as a model for integration of R and C components using low temperalare PWB compatible fabrication processes. Ohmega-Ply resistor/conductor laminates and photodefinable epoxies filled with high K ceramic powders were used as candidate materials for fabrication of embedded resistors and thin film capacitors. In order to reduce in-plane device area, multilayer (currently, two-layer) capacitors were stacked in the thickness direction. Meniscus coating of filled polymer dielectrics over large area (12 in x 12 in) was evaluated for cost and manufacturability advantages. This paper discusses the design, choice of materials, and fabricatilon issues of an integrated RC device. 1. Introlduction The Packaging Research Center at Georgia Tech is in the process of developing low temperalure MCM-L based processes suitable ICR L

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MCM-L兼容集成电阻和电容器

无源元件的集成提供了诸如减小尺寸、密度、成本以及提高封装效率和可靠性等固有优势。选择需要较大电容和电阻的集成RC网络作为模型，使用低温PWB兼容制造工艺集成R和C组件。采用高K陶瓷粉末填充欧米茄层压电阻/导体层压板和光可定义环氧树脂作为制备嵌入式电阻和薄膜电容器的候选材料。为了减小器件面内面积，多层(目前为两层)电容器在厚度方向上堆叠。对大面积(12英寸x 12英寸)填充聚合物电介质的半月板涂层的成本和可制造性优势进行了评估。本文讨论了一种集成RC装置的设计、材料选择和制造问题。1. 佐治亚理工学院封装研究中心正在开发适用于ICR L的低温MCM-L工艺

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Proceedings. 4th International Symposium on Advanced Packaging Materials Processes, Properties and Interfaces (Cat. No.98EX153)

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