{"title":"High Efficiency 5W/10W 32 - 38GHz Power Amplifier MMICs Utilizing Advanced 0.15µm GaN HEMT Technology","authors":"Shuoqi Chen, S. Nayak, C. Campbell, E. Reese","doi":"10.1109/CSICS.2016.7751040","DOIUrl":null,"url":null,"abstract":"This paper describes the design and measured performance of two high efficiency Ka-band 32 - 38 GHz power amplifier MMICs fabricated with an advanced 0.15μm Gallium Nitride (GaN) HEMT technology process. The process features a 50μm thin Silicon Carbide (SiC) substrate and compact transistor layouts with individual source via (ISV) grounding. The designs utilize an optimum transistor arrangement with both single-ended and balanced approaches. The 2-stage single-ended power amplifier MMIC demonstrates 4.5 - 5.2 W of output power with 25 - 34% PAE over 32 - 38 GHz band. For the second MMIC, two 3-stage power amplifiers are combined to achieve 9.0 - 11.2 W output power with 30 - 35% PAE over the same frequency range. A benchmark of 1.45W/mm2 FOM (output power to die area ratio) with high efficiency is reported at this frequency band.","PeriodicalId":183218,"journal":{"name":"2016 IEEE Compound Semiconductor Integrated Circuit Symposium (CSICS)","volume":"28 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2016-10-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"35","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2016 IEEE Compound Semiconductor Integrated Circuit Symposium (CSICS)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/CSICS.2016.7751040","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 35
Abstract
This paper describes the design and measured performance of two high efficiency Ka-band 32 - 38 GHz power amplifier MMICs fabricated with an advanced 0.15μm Gallium Nitride (GaN) HEMT technology process. The process features a 50μm thin Silicon Carbide (SiC) substrate and compact transistor layouts with individual source via (ISV) grounding. The designs utilize an optimum transistor arrangement with both single-ended and balanced approaches. The 2-stage single-ended power amplifier MMIC demonstrates 4.5 - 5.2 W of output power with 25 - 34% PAE over 32 - 38 GHz band. For the second MMIC, two 3-stage power amplifiers are combined to achieve 9.0 - 11.2 W output power with 30 - 35% PAE over the same frequency range. A benchmark of 1.45W/mm2 FOM (output power to die area ratio) with high efficiency is reported at this frequency band.