Safety shutdown of process equipment by automatic remote operation — Kuniaki Ishimoto

Abstract

Japan Semiconductor Corporation (JSC) has been mainly manufacturing 8inch product wafers at 2 facilities, located at Iwate and Oita in Japan (Figure1). At present, both operations are sharing 80% or more of the processes(Figure2). Furthermore, we are advancing the improvement of both facility and production equipment in order to achieve “PGA 500Gal”. ∗PGA : peak ground acceleration.