A prospective on education of new generations of devices in the FDSOI and FinFET technologies: From the technological process to the circuit design specifications

O. Bonnaud, L. Fesquet
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引用次数: 5

Abstract

The upcoming of FDSOI and FinFET technologies at nanoscale enlarges the gap between education and industry. Indeed, no university is able to provide access to such technologies before post-graduation. In addition, the situation is similar when looking at the integrated circuit design. The incredible degrees of freedom offered by the CAD tools to designers and the need to integrate more constraints makes really challenging the design of complex integrated circuits. The universities are facing really difficult issues on pedagogical point of view: designing and fabricating integrated circuits with no real experience in the advanced technologies and the design techniques. In this context, this paper investigates what should be the content of curricula of Masters or engineers diploma in order to efficiently prepare the students to work as well in this industry as in the research laboratories. Several suggestions will be provided.
FDSOI和FinFET技术中新一代器件的教育展望:从工艺过程到电路设计规范
纳米级FDSOI和FinFET技术的到来扩大了教育与工业之间的差距。事实上,没有一所大学能够在毕业前提供使用这些技术的机会。此外,在集成电路设计方面,情况也是类似的。CAD工具为设计人员提供了令人难以置信的自由度,并且需要集成更多的约束,这对复杂集成电路的设计构成了真正的挑战。从教学的角度来看,高校面临着一个非常困难的问题:在没有先进技术和设计技术的实际经验的情况下设计和制造集成电路。在此背景下,本文探讨了硕士或工程师文凭课程的内容,以便有效地为学生在该行业和研究实验室的工作做好准备。将提出几项建议。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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