Military Multichip Module Packaging Design And Manufacture

Abstract

Multichip modules (MCM) are being developed as a lightweight, high performance packaging technology for advanced electronics systems. Specifically, the hermetic form of MCM provides the highest level of circuit integration and performance for military applications. MCM technology development includes the design and manufacture of a variety of substrate types, assembly methods, and package. constructions. The selection of the most appropriate MCM technology is driven by specific design requirements and cost. Design-for-manufacturability is key to minimum cost and maximum producibility. This paper discusses MCM packaging design and manufacturing plus reliability and durability issues relating to qualification for military application.