Array Module Connector Test Program at Unisys

Abstract

Interconnection of multichip modules to their next higher assembly (normally a printed wiring board) has the same set of problems the industry has always had to manage, however, some of the problems have been exacerbated in today's applications. Performance requirements are getting tighter as modules now operate at 100 megahertz and up. With an increasing size of the modules, the mismatch in the thermal coefficient of expansion (TCE) between the module and the printed wiring board induces more stress. This manifests itself in reliability problems '%" the module has soldered terminations.