{"title":"Fabrication and characterization of carbon-aluminum thermal management composites","authors":"N. Jiang, J. Novak, R. Fink","doi":"10.1109/STHERM.2010.5444308","DOIUrl":null,"url":null,"abstract":"A carbon-based, aluminum composite material with low mass, high thermal conductivity and low coefficient of thermal expansion (CTE) has been developed and characterized in this study. The carbon-aluminum composite is fabricated by injecting molten aluminum into a porous graphitic carbon matrix using a high-pressure impregnation process. The CTE of the carbon-aluminum composite is 7 ppm/K, and the thermal conductivity is as high as 425 W/mK. The composite offers excellent thermal diffusivity, 2.5 - 3 times higher than that of Cu and Al, and a specific gravity less than that of Al.","PeriodicalId":111882,"journal":{"name":"2010 26th Annual IEEE Semiconductor Thermal Measurement and Management Symposium (SEMI-THERM)","volume":"28 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2010-04-08","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"4","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2010 26th Annual IEEE Semiconductor Thermal Measurement and Management Symposium (SEMI-THERM)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/STHERM.2010.5444308","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 4
Abstract
A carbon-based, aluminum composite material with low mass, high thermal conductivity and low coefficient of thermal expansion (CTE) has been developed and characterized in this study. The carbon-aluminum composite is fabricated by injecting molten aluminum into a porous graphitic carbon matrix using a high-pressure impregnation process. The CTE of the carbon-aluminum composite is 7 ppm/K, and the thermal conductivity is as high as 425 W/mK. The composite offers excellent thermal diffusivity, 2.5 - 3 times higher than that of Cu and Al, and a specific gravity less than that of Al.