Optimization of SiC Schottky diode using linear p-top for edge termination

Aryadeep Mrinal, Kumar M. P. Vijay, N. Vivek, M. Manjunatha, G. Sheu, Shao-Ming Yang
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Abstract

The trade-off between on-state and off-state characteristics of 4H-SiC Schottky diode has been optimized using linear p-top in the edge termination structure. The advantage of linear p-top has been illustrated by comparing results of 4H-SiC Schottky diode with planar structure using Silvaco Atlas Technology-computer-aided-design (TCAD) simulation tool. The breakdown-voltage characteristic of the SiC Schottky diode is significantly improved with the linear p-top edge termination. The planar SiC Schottky diode shows less than 300-V breakdown voltage, while the linear p-top structure shows breakdown voltage greater than 800-V with forward voltage <;1.5-V. The pronounced improvement in the breakdown-voltage characteristics is attributed to the reduction of electric field at the Schottky contact edge well by the linear p-top edge termination. The change in forward voltage and breakdown voltage with the variation in length of P-top mask in the termination region is observed.
基于线性p顶的SiC肖特基二极管边端优化
利用边缘端接结构中的线性p-top优化了4H-SiC肖特基二极管的通断特性。利用Silvaco Atlas technology计算机辅助设计(TCAD)仿真工具对4H-SiC肖特基二极管与平面结构的结果进行了比较,说明了线性p-top的优势。采用线性p顶边端接后,SiC肖特基二极管的击穿电压特性得到了显著改善。平面SiC肖特基二极管击穿电压小于300 v,线性p-top结构击穿电压大于800 v,正向电压< 1.5 v。击穿电压特性的显著改善是由于线性p顶边终止减小了肖特基接触边处的电场。观察到终端区正激电压和击穿电压随P-top掩模长度的变化。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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