mm W and High Speed Solutions Enabled by FD-SOI

S. Voinigescu
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Abstract

This paper will discuss the transistor level and building block characterization of 22-nm FD-SOI CMOS technology in the 25 to 125 oC range over the entire mm-wave frequency band through 325 GHz. Unlike older generation planar bulk CMOS or newer generation FinFET CMOS technologies, FD-SOI benefits from low capacitive parasitics, back-gate control of all DC and mm-wave characteristics, and dielectric isolation between transistors and between the transistor and the silicon substrate. All these features, in combination, along with minimal self-heating and the possibility to use extended source/drain contact stripes and gate pitch to overcome metal electromigration limitations at high temperature, uniquely position 22-nm FD-SOI CMOS to tackle mmwave and ultra-broadband 5G, automotive radar, mm-wave low-power sensor networks as well 56-GBaud and 112-GBaud ADC/DAC-based fibre-optics systems.
FD-SOI支持的mm W和高速解决方案
本文将讨论22纳米FD-SOI CMOS技术在25至125℃范围内的晶体管水平和构建块特性,覆盖整个毫米波频段至325 GHz。与老一代平面体CMOS或新一代FinFET CMOS技术不同,FD-SOI具有低电容寄生、所有直流和毫米波特性的反向控制、晶体管之间以及晶体管与硅衬底之间的介电隔离等优点。所有这些特性,再加上最小的自热,以及使用扩展源/源极接触条纹和栅极间距来克服高温下金属电迁移限制的可能性,使22纳米FD-SOI CMOS具有独特的位置,可用于毫米波和超宽带5G、汽车雷达、毫米波低功耗传感器网络以及56-GBaud和112-GBaud基于ADC/ dac的光纤系统。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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