Factors impacting the temperature dependence of soft errors in commercial SRAMs

M. Bagatin, S. Gerardin, A. Paccagnella, Carla Andreani, Giuseppe Gorini, A. Pietropaolo, S. Platt, Christopher Frost
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引用次数: 10

Abstract

We performed neutron and alpha-particle irradiation to reproduce the effects of the terrestrial environment on several commercial SRAMs manufactured by different vendors. We observed that, depending on the tested vendor, the number of errors either increases or slightly decreases for rising temperature, even in devices belonging to the same technology node. SPICE simulations were then used to investigate the temperature dependence of parameters like the feedback time and restoring current of the cell. The shape and magnitude of the particle-induced transient current was discussed as a function of temperature. The variability in the temperature response was attributed to the balance of contrasting factors, such as cell slowing down and increased diffusion collection with increasing temperature.
影响商用sram软误差温度依赖性的因素
我们对不同厂商生产的几种商用sram进行了中子和α粒子辐照,以再现地面环境的影响。我们观察到,根据测试供应商的不同,即使在属于同一技术节点的设备中,误差数量也会随着温度的升高而增加或略有减少。然后使用SPICE模拟来研究电池反馈时间和恢复电流等参数对温度的依赖性。讨论了粒子感应瞬态电流的形状和大小随温度的变化规律。温度响应的可变性归因于不同因素的平衡,如细胞速度减慢和扩散收集随温度升高而增加。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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