{"title":"Enhancing Generalization of Wafer Defect Detection by Data Discrepancy-aware Preprocessing and Contrast-varied Augmentation","authors":"Chaofei Yang, H. Li, Yiran Chen, Jiang Hu","doi":"10.1109/ASP-DAC47756.2020.9045391","DOIUrl":null,"url":null,"abstract":"Wafer inspection locates defects at early fabrication stages and traditionally focuses on pixel-level defects. However, there are very few solutions that can effectively detect largescale defects. In this work, we leverage Convolutional Neural Networks (CNNs) to automate the wafer inspection process and propose several techniques to preprocess and augment wafer images for enhancing our model’s generalization on unseen wafers (e.g., from other fabs). Cross-fab experimental results of both wafer-level and pixel-level detections show that the F1 score increases from 0.09 to 0.77 and the Precision-Recall area under curve (PR AUC) increases from 0.03 to 0.62 using our proposed method.","PeriodicalId":125112,"journal":{"name":"2020 25th Asia and South Pacific Design Automation Conference (ASP-DAC)","volume":"38 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2020-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2020 25th Asia and South Pacific Design Automation Conference (ASP-DAC)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ASP-DAC47756.2020.9045391","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 0
Abstract
Wafer inspection locates defects at early fabrication stages and traditionally focuses on pixel-level defects. However, there are very few solutions that can effectively detect largescale defects. In this work, we leverage Convolutional Neural Networks (CNNs) to automate the wafer inspection process and propose several techniques to preprocess and augment wafer images for enhancing our model’s generalization on unseen wafers (e.g., from other fabs). Cross-fab experimental results of both wafer-level and pixel-level detections show that the F1 score increases from 0.09 to 0.77 and the Precision-Recall area under curve (PR AUC) increases from 0.03 to 0.62 using our proposed method.
晶圆检测在早期制造阶段定位缺陷,传统上侧重于像素级缺陷。然而,很少有解决方案可以有效地检测大规模缺陷。在这项工作中,我们利用卷积神经网络(cnn)来自动化晶圆检测过程,并提出了几种预处理和增强晶圆图像的技术,以增强我们的模型对未见晶圆(例如,来自其他晶圆厂)的泛化。晶圆级和像素级检测的跨晶圆实验结果表明,该方法的F1分数从0.09提高到0.77,曲线下精确召回面积(Precision-Recall area under curve, PR AUC)从0.03提高到0.62。