Atomic-scale modeling of source-to-drain tunneling in ultimate Schottky barrier double-gate MOSFETs

M. Bescond, J. Autran, D. Munteanu, N. Cavassilas, M. Lannoo
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引用次数: 15

Abstract

The transport properties of single conduction channel Schottky barrier double-gate MOSFETs have been investigated by self-consistently solving the 2D Poisson equation with the Schrodinger equation, expressed in tight-binding using the Green's function formalism. In this atomic-scale approach, the source-channel-drain axis of the transistor has been modeled by an atomic linear chain, sandwiched between two silicon oxides and gate electrodes. The dependence of source-to-drain tunneling with channel length and gate electrode workfunction as well as its impact on device characteristics have been carefully investigated. The results show that source-to-drain tunneling does set an ultimate scaling limit well below 10 nm.
终极肖特基势垒双栅mosfet源极-漏极隧穿的原子尺度模型
本文研究了单导通道肖特基势垒双栅极mosfet的输运特性,采用自洽法求解二维泊松方程和用格林函数形式表示的紧密结合的薛定谔方程。在这种原子尺度的方法中,晶体管的源-沟道-漏极轴是由夹在两个硅氧化物和栅极之间的原子线性链来模拟的。研究了源极-漏极隧道效应与通道长度和栅极工作函数的关系及其对器件特性的影响。结果表明,源极-漏极隧道确实设置了远低于10 nm的最终结垢极限。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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