Packaging technology for smart power applications

[1991] Proceedings of the 3rd International Symposium on Power Semiconductor Devices and ICs Pub Date : 1991-04-22 DOI:10.1109/ISPSD.1991.146057

C. Neugebauer

引用次数: 0

Abstract

The author briefly reviews packaging technology for smart power applications. Attention is given to packaging for low to medium voltages and for high voltages; to protective networks; and to smart power hybrids.<>

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智能电源应用的封装技术

本文简要综述了智能电源应用中的封装技术。注意低压到中压和高压的包装;保护网络;还有智能动力混合动力车。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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来源期刊

[1991] Proceedings of the 3rd International Symposium on Power Semiconductor Devices and ICs

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