Modelling technology to predict flip-chip assembly

D. Wheeler, C. Bailey
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引用次数: 1

Abstract

This paper describes modelling technology and its use in providing data governing the assembly of flip-chip components. Details are given on the reflow and curing stages as well as the prediction of solder joint shapes. The reflow process involves the attachment of a die to a board via solder joints. After a reflow process, underfill material is placed between the die and the substrate where it is heated and cured. Upon cooling the thermal mismatch between the die, underfill, solder bumps, and substrate will result in a nonuniform deformation profile across the assembly and hence stress. Shape predictions then thermal solidification and stress prediction are undertaken on solder joints during the reflow process. Both thermal and stress calculations are undertaken to predict phenomena occurring during the curing of the underfill material. These stresses may result in delamination between the underfill and its surrounding materials leading to a subsequent reduction in component performance and lifetime. Comparisons between simulations and experiments for die curvature will be given for the reflow and curing process.
预测倒装芯片组装的建模技术
本文描述了建模技术及其在提供控制倒装芯片组件组装的数据方面的应用。详细介绍了回流和固化阶段以及焊点形状的预测。回流过程包括通过焊点将模具连接到电路板上。在回流过程后,下填充材料被放置在模具和基材之间,在那里它被加热和固化。冷却后,模具、衬底、焊料凸起和基板之间的热不匹配将导致整个组装的不均匀变形,从而产生应力。在回流过程中对焊点进行了形状预测、热凝固和应力预测。热应力计算用于预测下填料固化过程中发生的现象。这些应力可能导致下填料与其周围材料之间的分层,从而导致组件性能和寿命的降低。对回流和固化过程的模具曲率进行了仿真和实验比较。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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