Investigating thermal excursion failure mechanisms for flip chip

Abstract

Flip Chip assembly offers a reliable, sinall footprint, thermally enhanced alternative to wire bonding. New copper ‘bumps”increase Flip Chip advantages for GaAs devices. This study will address failure mechanisms accelerated by thermal excursions for new copper bumps. Thermal excursion mechanisms are ones accelerated by temperature cycling, thcnnal shock, simulation of assembly reflow or power cycling.[i J