{"title":"High-pin-count Quad Flat Package With Thin-film Termination Resistors","authors":"S. Sasaki, T. Kishimoto","doi":"10.1109/IEMT.1993.639382","DOIUrl":null,"url":null,"abstract":"This paper describes a high-pin-count quad flat package with termination resistors for high-speed and high-pin-count LSI chips. This package has 196 I/O leads with thin-film termination resistors formed around the chip mounting cavity. Termination resistors with accurate resistance values can easily be formed without trimming. This p,ackage has good electrical performance - low crosstalk noise and little waveform distortion - and it can transmit high-speed pulses up to 1.0 Gb/s (MU). This prototype package is suitable for high-speed, high-pin- count LSI chips for high-speed systems. INTRODUCI'ION","PeriodicalId":170695,"journal":{"name":"Proceedings of Japan International Electronic Manufacturing Technology Symposium","volume":"1 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1993-06-09","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"1","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Proceedings of Japan International Electronic Manufacturing Technology Symposium","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/IEMT.1993.639382","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 1
Abstract
This paper describes a high-pin-count quad flat package with termination resistors for high-speed and high-pin-count LSI chips. This package has 196 I/O leads with thin-film termination resistors formed around the chip mounting cavity. Termination resistors with accurate resistance values can easily be formed without trimming. This p,ackage has good electrical performance - low crosstalk noise and little waveform distortion - and it can transmit high-speed pulses up to 1.0 Gb/s (MU). This prototype package is suitable for high-speed, high-pin- count LSI chips for high-speed systems. INTRODUCI'ION