High-pin-count Quad Flat Package With Thin-film Termination Resistors

S. Sasaki, T. Kishimoto
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引用次数: 1

Abstract

This paper describes a high-pin-count quad flat package with termination resistors for high-speed and high-pin-count LSI chips. This package has 196 I/O leads with thin-film termination resistors formed around the chip mounting cavity. Termination resistors with accurate resistance values can easily be formed without trimming. This p,ackage has good electrical performance - low crosstalk noise and little waveform distortion - and it can transmit high-speed pulses up to 1.0 Gb/s (MU). This prototype package is suitable for high-speed, high-pin- count LSI chips for high-speed systems. INTRODUCI'ION
带薄膜终端电阻的高引脚数四平面封装
本文介绍了一种用于高速和高引脚数LSI芯片的带端接电阻的高引脚数四平面封装。该封装有196个I/O引线,在芯片安装腔周围形成薄膜终端电阻。具有精确电阻值的终端电阻器可以很容易地形成,而无需修剪。该封装具有良好的电气性能-低串扰噪声和小波形失真-并且可以传输高达1.0 Gb/s (MU)的高速脉冲。该原型封装适用于高速系统的高速、高引脚数LSI芯片。INTRODUCI 'ION
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