Method of problem solving to diagnose high particle failures due to unique rotation stopping position: CFM: Contamination free manufacturing

Jessica Gruss-Gifford, T. Haigh, P. Hall, J. Wynne, John Grassucci, D. O'Meara, Joshua Prendergast, Kyle Dwyer, Paul T. Higgins
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Abstract

Particle defects in the form of foreign material (FM) are a common occurrence in semiconductor manufacturing. This work discusses the strategies used to detect the source of FM particles in a room temperature oxide furnace. FM particles were measured during the 215 Å oxide recipe qualification and showed counts as high 603 particles, exceeding the limit of 130 particles. Common sources of FM particles such as hardware contamination and process recipe conditions were ruled out as the root cause. It was discovered that the rotation stop position of the boat during deposition for the 215 Å recipe put the pedestal alignment pin (attached to the elevator) in front of the backfill N2 injector during the backfill sequence of the recipe. The high flow of 30 slm during the backfill caused the pin to vibrate and produce particles. The probability of stopping at this position for a given recipe is 1 out of 360. The final solution was to make all recipes stop at a home position to guarantee the pin does not stop in front of the N2 injector.
由于独特的旋转停止位置,诊断高颗粒故障的问题解决方法:CFM:无污染制造
外来物质(FM)形式的颗粒缺陷是半导体制造中常见的现象。本文讨论了在室温氧化炉中检测FM颗粒来源的策略。在215 Å氧化物配方鉴定过程中对FM颗粒进行了检测,结果显示FM颗粒高达603个,超过了130个的限值。常见的FM颗粒来源,如硬件污染和工艺配方条件被排除为根本原因。发现在215 Å配方的沉积过程中,船的旋转停止位置将底座对中销(附在提升机上)放在该配方的回填顺序中N2注入器的前面。在回填过程中,30 slm的大流量导致销钉振动产生颗粒。对于一个给定的配方,停在这个位置的概率是1 / 360。最后的解决方案是使所有的配方停止在一个家庭的位置,以保证针不会停止在氮气注入器前。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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