Modelling the Temperature Conditions of a Printed Circuit Board

Abstract

In this study the development of a model describing the power dissipation process of a PCB with SMD components is presented. It is based on well-known physical dependencies and the Finite difference method. An experimental study was conducted and several temperatures were measured: of the investigated PCB, of the PCB casing (box) and of the environment. The measured values were used to obtain the parameters of the model and to validate it. The obtained results showed that the modelled and measured temperatures of the PCB and of the casing are practically identical. This shows the developed model can be used for investigation of the thermal regime of electronic equipment with high accuracy.